Our Company Invited to Attend 2025 Spring International PCB Technology/Information Forum

On March 23-24, the 2025 Spring International PCB Technology/Information Forum, hosted by the China Printed Circuit Association (CPCA), was successfully held in Shanghai. Representatives from our company including Chen Shijin from the Technical Management Department, Zhang Changming from the Intellectual Property Department of Shenzhen Factory, and Wang Kun from the R&D Department of Jiangsu Factory attended the event upon invitation, participating in award ceremonies, keynote speeches, and industry technical exchange activities.

Organized by the CPCA Science and Technology Working Committee, this forum adopted the theme "Innovative Development, Intelligent Future," focusing on cutting-edge PCB technologies and innovative applications across the entire industrial chain from materials, design, R&D to manufacturing. Our company representatives delivered three technical presentations: Zhang Changming shared "Discussion on Preparation of Composite Ceramic Substrates for Embedded Silicon Carbide Semiconductor Devices" and "Ceramic-based Rigid-flex Board Process Technology for HD Camera Modules," while Wang Kun presented "Research on Printed Circuit Plugging Technology Applied to Board-level Embedded Resistors." All related papers were included in the forum's technical proceedings.

At concurrent events including the "2025 China Electronic Circuit Innovation Achievement Night" & Jiangxi Suichuan Electronic Circuit Industry Investment Promotion Conference, and the "2025 CPCA SHOW Opening Gala," our company received multiple industry honors:

Chen Shijin was awarded both the "2024 Outstanding Individual Award of CPCA Science and Technology Working Committee" and "2024 Outstanding Individual Award of Standardization Working Committee";

Sun Binghe's paper "Impact Analysis of Post-heat Treatment on PCB Electroplated Copper Processes and Performance" from the Technical Management Department won the "2024 Best Paper Award";

Ye Shengtao's paper "Research on Process Technology for Latest-generation Eagle Stream Platform Server Motherboards" from Meizhou Factory R&D Department received the "2024 Third Prize for Outstanding Industry Paper".

This participation fully demonstrated our company's technical capabilities and industry influence in the PCB field. Moving forward, we will continue to deepen PCB technological innovation, strengthen industry-academia-research collaboration, accelerate R&D of high-end products and technological upgrades, drive high-quality development through innovation, and contribute to advancing China's electronic circuit industry towards high-precision and high-integration development!